Surface Mount Technology (SMT) has become a cornerstone in modern electronics manufacturing, offering a highly efficient and reliable method for assembling electronic components onto printed circuit boards (PCBs). As a next-generation assembly technique, SMT provides numerous advantages such as compact design, high resistance to vibration and impact, excellent high-frequency performance, and significantly improved production efficiency. It has since become the dominant approach in PCB assembly processes.
The standard SMT process typically involves three main steps: applying solder paste, mounting components, and reflow soldering. The first step, solder paste application, is crucial for ensuring proper electrical and mechanical connections. Using specialized equipment, an accurate amount of solder paste is evenly spread on the PCB pads, preparing them for component placement. This step ensures that the components will be securely attached during the reflow process.
Solder paste itself is a viscous mixture composed of alloy particles, flux, and additives. At room temperature, it maintains enough viscosity to hold components in place, preventing movement unless subjected to external forces or excessive tilt. When heated during reflow, the alloy melts, allowing the solder to wet both the component leads and the PCB pads. Upon cooling, this creates strong, conductive solder joints.
Solder paste can be applied using various methods, including automatic and semi-automatic printing machines, manual printing tables, and dispensers. Each method has its own benefits and limitations. For example, automatic printing is ideal for large-scale production due to its speed and consistency, while manual methods are more suitable for small batches or prototype development.
The second stage of the SMT process is component placement, where surface-mount devices (SMDs) are accurately positioned on the PCB. This can be done either by automated placement machines or manually with tools like vacuum pens, tweezers, and magnifying glasses. Automated systems offer higher precision and efficiency, especially for mass production, whereas manual placement allows for greater flexibility in small runs or custom designs.
Our professional SMT factory is equipped with advanced production lines, state-of-the-art machinery, and experienced teams. We specialize in handling a wide range of components, from small 0201 chips to high-precision QFP and BGA packages with a pitch as fine as 0.3mm. Our facilities include imported multi-zone reflow ovens, fully automatic no-clean wave soldering systems, and high-speed solder paste printers, ensuring superior quality and accuracy.
With over a decade of industry experience, our team adheres to strict quality standards, including IPC-A-610C Class II. We maintain a product pass rate of over 99%, reflecting our commitment to excellence. Our business philosophy focuses on customer satisfaction, innovation, and sustainable growth. We continuously integrate advanced technologies from around the world to meet evolving market demands.
Our SMT production lines are equipped with the latest technology:
- **LINE 1**: Semi-auto printer + MSH2 + MV2C-A + MPA-3 + Taiwan Tech Reflow (11 Zones)
- **LINE 2**: Semi-auto printer + MSH2 + MV2C-A + MPA-3 + Green Reflow (5 Zones)
- **LINE 3**: SPP-G1 + MSH2 + MV2F + MPA 3 + Flextronics Reflow (5 Zones)
- **LINE 4**: DEK ELA + MSH2 + MV2F + MPA-3 + Kelong Reflow (8 Zones)
- **LINE 5**: DEK 265GSX + MSHG1 + MV2F + MPA-G1 + Heller 1800W (8 Zones)
- **LINE 6**: SPPD + TCM3500Z + Heller 1800EXL (8 Zones)
We support component placement speeds as fast as 0.16 seconds per part, with a minimum component size of 0.25mm x 0.125mm and precision up to 0.1mm. Our capabilities extend to ultra-thin PCBs, flexible boards, and even gold finger boards. We handle complex products such as TFT display driver boards, mobile phone motherboards, and battery protection circuits.
In addition to SMT processing, we also provide PCB copy design, chip decryption, BOM list creation, PCB layout, and prototype debugging services. As one of Shenzhen’s most professional PCB copy companies, we are dedicated to delivering fast, high-quality solutions tailored to your needs.
**Contact Us:**
Address: 11E, Jinghai Garden, Fuhua Road, Futian District, Shenzhen
Website: [http://example.com](http://example.com)
Email: info@example.com
Phone: Yang Gong – 13352923650 | Miss Zhang – 13058188266
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